Zhao Chen wins second prize in SSCS Benelux Chip Design Contest
- Monday, 28 May 2018
For the third year, the IEEE SSCS Benelux Chapter organized a Chip Design Contest for MSc and PhD students in the Benelux. This year, the second prize was won by Zhao Chen, for his contribution “A Front-End ASIC with Integrated Subarray Beamforming ADCs for Miniature 3D Ultrasound Probes”. Zhao received the award at the 2018 SSCS Benelux Chip Design Workshop, which was held at the University of Leuven on May 22, 2018.
More details on Zhao’s award-winning work can be found in the following paper: C. Chen, Z. Chen, D. Bera, E. Noothout, Z. Y. Chang, M. Tan, H. J. Vos, J. G. Bosch, M. D. Verweij, N. de Jong, and M. A. P. Pertijs, “A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes,” in Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC), pp. 186-188, Feb. 2018.
Perspectief Programme ULTRA-X-TREME Granted
NWO has announced that the ULTRA-X-TREME programme, in which the Ultrasound ASICs group of the Electronic Instrumentation Lab participates, is one of the six Perspectief Programmes that will be funded.
Our work on Intravascular Ultrasound featured on the cover of TUFFC
A paper of the Ultrasound ASICs group on Intravascular Ultrasound is featured on the cover of the Oct 2018 issue of the IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
Six papers at the 2018 IEEE Ultrasonics Symposium
At the 2018 IEEE Ultrasonics Symposium (IUS) - the world’s premier conference on ultrasound research held in Kobe, Japan, in October - we presented six papers covering various aspects of our work on integrated circuits for smart ultrasound applications.